Embedded Modules

ARM Architecture

Embedded module TQMa28

ARM9 module with i.MX28 from NXP

 

Key functionalities:

  • Low-cost due to highest levels of integration
  • Compact dimensions
  • Extended temperature range
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Low power consumption (typ. 1 W)
  • Long-term availability
  • Power management
  • IEC 61850 stack

 

Embedded module TQMa28L

ARM9 module with i.MX28 from NXP

 

Key functionalities:

  • Smallest ARM9 module
  • High quantity use
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Extended temperature range
  • Low power consumption (typ. 1 W)
  • Long-term availability
  • Power management
  • Battery charge functionality
  • IEC 61850 stack

 

Embedded module TQMa335x

ARM Cortex-A8 module with Sitara™ AM335x from Texas Instruments.

 

Key functionalities:

  • Real-time communications subsystem
  • Low-cost due to highest level of integration
  • Extended temperature range
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Low power consumption (typ. 2 W)
  • Long-term availability

 

Embedded module TQMa335xL

ARM Cortex-A8 module with Sitara™ AM335x from Texas Instruments.

 

Key functionalities:

  • Real-time communications Subsystem
  • Recommended for high quantity use
  • Low-cost due to highest level of integration
  • Extended temperature range
  • 2x IEEE1588 Ethernet (L2 Switch)
  • Low power consumption (typ. 2 W)

 

Embedded module TQMa35

ARM11 module with i.MX35 from NXP.

 

Key functionalities:

  • All CPU interfaces are available
  • Extended boot options (USB, SD card)
  • eMMC-Flash
  • Extended temperature range
  • Low power consumption (typ. 2-3 W)
  • Long-term availability
  • IEC 61850 stack

 

Embedded module TQMa53

ARM Cortex™-A8 module with i.MX53 from NXP

 

Key functionalities:

  • All CPU interfaces are available
  • Graphics
  • Extended temperature range
  • e-MMC-Flash
  • Low power consumption (typ. 3 W)
  • Long-term availability
  • IEEE 1588 support
  • Security functions

 

Embedded module TQMa6ULx

ARM Cortex™-A7 module with i.MX6UL from NXP.

 

Key functionalities:

  • Graphic
  • Extended temperature range
  • 2x Ethernet with IEE1588
  • Low power consumption (typ. 1 W)
  • Camera sensor interface
  • Security functions
  • Long-term availability

 

Embedded module TQMa6x

ARM Cortex™-A9 module with i.MX6 from NXP.

 

Key functionalities:

  • Graphic
  • Extended temperature range
  • e-MMC Flash
  • NOR Flash
  • Low power consumption (typ. 4 W)
  • Long-term availability
  • IEEE 1588 Support
  • Security functions

 

Embedded module TQMa7x

ARM Cortex™-A7 module with i.MX7 from NXP.

 

Key functionalities:

  • Graphic with full HD support
  • Extended temperature range
  • High-Speed communication via 2x Gigabit Ethernet and 1xPCIe Interface
  • Low power consumption (typ. 2 W)
  • Integrated Cortex M4
  • IEEE 1588 hardware Support
  • Security functions

 

Embedded module TQMLS102xA

ARM Dual Cortex™-A7 module with LS102xA from NXP.

 

Key functionalities:

  • Graphics
  • Extended temperature range
  • High-Speed communication via 3x Gigabit Ethernet, 2x PCle and 1x USB 3.0 interface
  • Low power consumption (typ. 3 W)
  • QorIQ Trust Architecture and ARM TrustZone
  • IEEE 1588 support
  • Security functions and QUICC Engine
  • Long-term availability
NXP Power Architecture

Embedded module TQM5200

Power Architecture module with MPC5200 from NXP.
Key functionalities:

  • NXP MPC5200 (Power Architecture), 400 MHz
  • High graphics performance through integrated graphics controller (SM501/SM502)
  • Substantial computing power, numerous interfaces
  • Multifunctional external busses (PCI / ATA / IDE)
  • Compact outer dimensions (80mm x 60mm)
  • Low power dissipation, passive cooling
  • Robust 0,8mm mezzanine connection system, long-term availability

 

Embedded module TQM5200S

Power Architecture module with MPC5200 from NXP.
Key functionalities:

  • NXP MPC5200 (Power Architecture), 400 MHz
  • Substantial computing power, numerous interfaces
  • Multifunctional external bus (PCI / ATA / IDE)
  • Up to 6 serial interfaces
  • Compact outer dimensions (60mm x 56mm)
  • Low power dissipation, passive cooling
  • Robust 0,8mm mezzanine connection system, long-term availability
  • Temperature sensor

 

Embedded module TQMP1020

Power Architecture module with NXP QorIQ™ P1020 processor.
Key functionalities:

  • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
  • Single (P1011/P1012)- and MultiCores (P1020/P1021) of 400 up to 2x 800 MHz in 45nm SOI for best Performance/Watt ratio
  • High-Speed communication via 3x Gigabit Ethernet, 2x PCIe and one USB 2.0 interface
  • Simple function extension via PCIe, SPI, I²C and flexible local bus

 

Embedded module TQMP2020

Power Architecture module with NXP QorIQ™ P2020 processor
Key functionalities:

  • Easiest migration of PowerQUICC III on QorIQ™ by approved e500v2 core
  • Single (P2010)- and MultiCores (P2020) of 400 up to 2x 1200 MHz in 45nm SOI for best Performance/Watt ratio
  • High-Speed communication via 3x Gigabit Ethernet, 3x PCIe and one USB 2.0 interface
  • Simple function extension via PCIe, SPI, I²C and flexible local bus

 

Embedded module TQMT1040

Power Architecture module with QorIQ™ T1040 processor from NXP.
Key functionalities:

  • Quad core up to 1400 MHz in 28 nm SOI for the best Performance/Watt ratio
  • High speed communication with a combination of up to 4x Gigabit Ethernet and integrated 8-Port Switch, 4x PCle and two USB 2.0 interfaces
  • Dual SATA interfaces for data storage
  • Easy function extensions via PCle, eSPI, I²C and IFC (Local Bus)
  • IEEE 1588 time synchronization in hardware
  • Extremely compact module dimensions
  • Display Interface Unit

 

Embedded module TQMT1042

Power Architecture module with QorIQ™ T1042 processor from NXP.

 
Key functionalities:

  • Quad core up to 1400 MHz in 28 nm SOI for the best Performance/Watt ratio
  • High-speed communication via 5x Gigabit Ethernet, 4x PCle and two USB 2.0 High Speed interfaces
  • Dual SATA interfaces for data storage
  • Easy function extensions via PCle, eSPI, I²C and IFC (Local Bus)
  • IEEE 1588 time synchronization in hardware
  • Extremely compact module dimensions
  • Display Interface Unit
NXP ColdFire

ColdFire module with MCF5329 from NXP.

 

The TQM5329 Minimodule, based on the NXP MCF5329 processor, offers a balanced ratio between computing and graphic performance. The basis for this is a ColdFire V3 core with up to 240 MHz. The extended memory implemented on the module ensures ideal system support.

 
With the high level of interface and function integration in the CPU a large number of interfaces and module functions are implemented. This allows the basic board to be developed easily and at low-cost. The RTC on the module offers extended functionality. All the processor’s functional pins are on the module plug-in connector.

 

Key functionalities:

  • Low-cost due to highest levels of integration
  • Extended temperature range
  • Large number of interfaces
  • Low power consumption (typ. < 1 W)
  • Long-term availability
  • Small dimensions
x86

Embedded Module TQMx70EB

COM Express® Basic Modul (Type 6)

 
Key functionalities:

  • Intel® Core™ 7000E series / Intel® Xeon® E3-15xx v6 series (“Kaby Lake-H”) with up to Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance (Intel® Iris™ Pro 630)
  • with hardwarebased 10-bit HEVC and VP9 en-/decoding
  • Intel® Optane™ 3D XPoint SSD support
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • High bandwidth with up to 24 PCIe Gen. 3 lanes (incl. PCIe x16 PEG port)
  • TQMx86 board controller with flexible customization options (flexiCFG)
  • Mobile Intel® 100 series chipset (CM238)
  • TPM 1.2 / 2.0
  • “Green ECO-Off” (minimum of standby power)
  • Watchdog und thermal management
  • Highest reliability, 24/7 certified
  • Quality Made-in-Germany

 

Embedded Module TQMx60EB

COM Express® Basic Modul (Type 6)

 
Key functionalities:

  • Intel® Core™ 6000E series / Intel® Xeon® E3-15xx v5 series (“Skylake-H”) with up to Quad-Core 3.7 GHz / 8 MB cache
  • Impressive graphics performance (Intel® Iris™ Pro)
  • Best in class power optimization
  • Up to 32 GB Dual-Channel DDR4 (2 SO-DIMMs), ECC
  • High bandwidth with up to 24 PCIe lanes (Gen. 3) (incl. PCIe x16 PEG port)
  • TQMx86 board controller with flexible customization options (flexiCFG)
  • Mobile Intel® 100 series chipset (CM236)
  • TPM 1.2 / 2.0
  • “Green ECO-Off” (minimum of standby power)
  • Watchdog und thermal management
  • Highest reliability, 24/7 certified
  • Quality Made-in-Germany

 

Embedded Module TQMx50UC

COM Express® Compact Module (Type 6)

 
Key functionalities:

  • Intel® Core™ 5000U series („Broadwell-U”) with up to 3.2 GHz / 4 MB Cache
  • Up to 16 GB DDR3L on board memory
  • Best Performance-per-Watt ratio (15W TDP)
  • Reach featured uEFI BIOS with easy-config, multi- setup and touch support
  • TQMx86 board controller with flexible customization options (flexiCFG)
  • TPM 1.2 / 2.0
  • iRTC (highly accurate industrial real time clock)
  • “Green ECO-Off” (minimum of standby power)
  • Watchdog und thermal Management
  • Highest reliability, 24/7 certified
  • Rugged design / Conformal coating capability
  • Quality Made-in-Germany

 

Embedded Module TQMxE38C

COM Express™ Compact Module (Type 6)

 
Key functionalities:

  • Intel® AtomTM E3800 (“Bay Trail-I”)
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface
  • TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • “Green ECO-Off” (minimum of standby power)
  • Watchdog and thermal management
  • Highest reliability, 24/7 certified
  • Extra robust Design
  • Formal coating capability

 

Embedded Module TQMxE38M

COM Express® Mini Module (Type 10)

 
Key functionalities:

  • Intel® AtomTM E3800 (“Bay Trail-I”)
  • Up to 8 GB DDR3L with ECC support, soldered
  • Optimized for ultra low power
  • Extended temperature support
  • Reach featured uEFI BIOS with easy-config, multi-setup and touch-support
  • TQMx86 board-controller with customer specific expandability (flexiCFG)
  • USB 3.0 device interface
  • TPM 1.2 / 2.0
  • iRTC (highly accurate Industrial Real-Time-Clock)
  • “Green ECO-Off” (minimum of standby power)
  • Watchdog and thermal management
  • Highest reliability, 24/7 certified
  • Extra robust Design
  • Formal coating capability
  • COM Express™ Mini Type 10 (COM.0, R 2.1)

 

Embedded Module TQMxE39M

COM Express® Mini Module (Type 10)

 
Key functionalities:

  • Intel® Atom™ x5/x7 E3900 series (“Apollo Lake-I”), Pentium® N4200 and Celeron® N3350 processors
  • Dual/Quad core computing power with up to 2.5 GHz
  • 4/8 GB DDR3L (dual channel), soldered
  • High-speed interconnected with Gigabit Ethernet, 8x USB (3.0 / 2.0) and up to 4 PCIe lanes
  • Dual Display support with DP/HDMI (up to 4K UHD) and eDP or LVDS
  • Up to 64 GB eMMC Flash, soldered
  • Extended temperature Support
  • Watchdog und thermal Management
  • Highest reliability, 24/7 certified
  • Conformal coating (optional) and optimized cooling solutions for ruggedized applications