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The N700 Series PCIe® Gen3 x4 NVMe M.2 Type 1620 heatsink ball-grid array (HSBGA) SSD are built with 3D TLC NAND flash configured as pSLC to deliver near native SLC performance at lower cost due to the higher cell density.
For effective thermal dissipation, these small powerhouses are outfitted with heatsink on top for 2X-3X better sustainable performance.
ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration for customers who prefer a removable and field-replaceable design.
ATP Electronics is the leading provider of “Industrial Only" high-performance, high-quality and high-endurance NAND flash products and DRAM modules.