Product news

Digi ConnectCore MP133 is a compact, wireless, and secure system-on-module based on the STMicroelectronics STM32MP133C MPU.

Two new integrated circuit families designed for the smallest form factor IoT devices: the xG27 family of Bluetooth systems on chips (SoCs) and the BB50 microcontroller unit (MCU).

EMX-TGLC a Thin Mini I T X board with 1111th Gen Intel® Core™ i3/i5 and Celeron® BGA Consumer SKU Processor

The module will have an 800x480 pixel resolution full colour TFT panel whereas the conventional 4.3” module has 480x272 pixels.

The Digi XBee® 3 Global Cellular module is a compact, programmable, reliable solution with BLE and end-device carrier certifications for developing secure wireless devices with worldwide connectivity and global positioning.

New 2.5” embedded single board computers, EPX-EHLP, with Intel® Pentium®/Celeron®/Atom™ SoC BGA Processor (Elkhart Lake Platform 4.5~12W), CPU bottom mounted, with huge improvement on performance and bug step ahead with Intel® UHD Graphics target entry-level application market.

The upcoming USB Type-C mandate in Europe will reduce e-waste by requiring this standard connector. Learn how to make your design safe and compliant.

New very compact filter series with the 5121 appliance inlet filter.

The BC66F2143 is a new Sub-1GHz RF OOK/FSK Transmitter Flash MCU. It can operate in the license-free ISM bands, has RF characteristics which are compliant with the ETSI/FCC specifications.

Download your 2023 Railway Power Solution Guide containing intro of railway certification, performance of rail certified products and railway certified power solutions

The ESM-1K0DxxxMx series is a 1000W, 2-channel, constant-current, programmable and IP66/IP67 rated LED driver that operates from 249-528Vac input with excellent power factor.

AM-OLED display is featured with wide temperature adaptation range; Low power consumption and thinner; high contrast and strong color reproduction.

ATP’s wide range of legacy and latest-generation NAND flash storage solutions in different form factors, endurance ratings, thermal, operating temperature, firmware, and customization options to meet the requirements of industrial and automation systems.

Powered by the latest NVIDIA Jetson AGX Orin platform, featuring advanced NVIDIA Ampere architecture with up to 275 TOPS of AI performance

Laird Connectivity and Boundary Devices’ embedded system-on-module (SOM) development platforms deliver highly scalable embedded processing solutions with 802.11a/b/g/n/ac and Bluetooth wireless.

Designed to make Proof of Concept (PoC) easier, the ADLINK AI Camera Dev Kit integrates the NVIDIA® Jetson Nano™ SOC, an 8MP color MIPI camera module and validated software drivers to save effort on integration and solve compatibility issues.

HELIO series and ARCHMI-9B are constructed by aluminum die-casting and is designed in fanless to remain rugged and good heat dissipation ability to operate under wide temperature 0°C~ 50°C or optional -20°C~ 60°C.

Since SO-DIMM is roughly half of the size of regular DIMMs, it is often used in systems with limited space, such as industrial PCs, edge Computing, IIoT devices, and networking hardware...etc.